The difference between heat pipe technology and VC technology

At present, the manufacturing process of ultra-thin heat pipes used in mobile phones is no different from that of ordinary heat pipes, but sintering copper net instead of copper powder with capillary structure, so as to adapt to the flat thickness below 0.4mm.

Ultra-thin VC adopts etching + brazing or diffusion welding process, and the products with thickness of 0.4mm, 0.35mm and 0.30mm applied in batch have entered the stage of verification or small batch trial production.

The difference in this process also leads to the thinner development of heat pipe and VC. Industry insiders believe that the thickness of D8 thin tube to reach 0.35mm and 0.30mm has been expected to have greater challenges in the process.

The difference between heat pipe and VC in application

In 5G smartphones, heat pipe and VC are generally bonded by the thermal interface material TIM. The cold end is in contact with the phone's heat source (AP), and the hot end is in contact with the body's alloy material. The heat rapidly diffuses into the alloy frame of the body through the rapid evaporation and condensation process of phase change filling working medium, and dissipates heat through natural air convection and radiation. At present, the ultra-thin VC can achieve 12~ 15W, the ultra-thin tube is 5~ 6W.

But it is worth noting that the large area use of heat pipe and mean temperature plate only makes the shell temperature more even. When the whole machine exceeds the natural heat dissipation limit, the uniform temperature technology will not be able to deal with the heat dissipation problem of the mobile phone, so new heat dissipation technology is needed.
The ultrathin heat pipe is one-dimensional and its effective length is limited by the thickness and internal structure of the telephone. At present, Nubia Red Devils 3S D5 tube is the longest ultra-thin tube in batch application in the industry, with a compression of 0.35mm and a length of 87mm. Compared with heat pipe, one of VC's main advantages is limited appearance, you can refer to the hardware layout of the phone, flexible adaptive design. The cold end contact surface can be enlarged and cover all heat source chips. Overall width and length can also be larger, abnormity, segment difference structure is no problem.